Wafer cleaning issues at the wet process
Current situation
Defects were found on the surface of the wafer after washing with the chemistry and rinsing with water.
Disadvantages
- The wafer contaminated with defects cannot be sold to the customer. The defective wafers will be scrapped.
- The process strongly depends on chemicals. Small change, even within spec limits, causes contamination of the wafers and a drop in the yield.
- The process and products are at high risk of failure due to even insignificant changes.
Ideal final result
Stable yield after using the chemistry from different vendors with no cost increase.
Gaps
Certain type of chemistry creates and leave defects on the silicon wafer during wet cleaning
Problem statement
Similar projects
The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)
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