Define the more contaminated areas and spend more time/chemical to clean the specific areas

Increase the temperature of the solution to make the process more effective

Principle #15 – Dynamism – change an object from rigid to movable or adaptiveThe idea that is generated is as follows:Replace the constant flow of the chemistry with variable flow, especially in the and of the process, to ensure defects removal from the disc.So, the idea is to change (even make pulses) flow while the cleaning process.

לטבול את הצלחת במים במקום לשטוף אותה בכל פעם

מערכת כיווון אוטמיטת למסוע

The wafer is contaminated not equally. Use special cleaning on the areas that are more contaminated

The general conclusion is to eliminate the system of the air supply and exhaust. Let air enter the chamber and convert exhaust to drain with very little under-pressure. The will stabilize the performance, reduce the cost and make the system more simple.

Principle #16 – Partial or accessive action – do slightly more or slightly lessIf 100 percent of an object is hard to achieve using a given solution method then, by using 'slightly less' or 'slightly more' of the same method, the problem may be considerably easier to solve.A wafer is not contaminated equally: there are some areas with more defects and some areas with fewer amount of defectsThe idea is to use the shower with a graduated flow - the more the defects the higher the flow

Principle #13 – The other way around – Turn the object “upside-down”This is a great tip. Indeed, why the disk is kept “face-up” during the washing process?It would be much better to keep the disc “face down” to improve the removal of the defects from the surface.So, the idea is to keep the wafer “face down” during the washing process﻿<img 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">

Increase the pressure in the chamber

Prevent evaporation of the chemistry from the wafer

To increase the density of the chemistry by temperature reduction

Try to eliminate the wasting. Do we really need this?

Improve the rinsing process to ensure the defects removal

Improve the process to enhance the effectiveness of the cleaning with the chemistry

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process.
Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing.
The project is dedicated to the failure analysis and creation of innovative solutions.

Wafer cleaning issues at the wet process

Projects related to innovations and problem solving in the microchip manufacturing

Wafer cleaning issues in the wet process

Anything related to the cubic measure of space occupied by an object or the space around it.   'Moving' includes any situations where there is any degree of relative motion or mobility between two or more parts related to the problem.  This relative motion may be a few microns or a considerable distance.

Volume of moving object

Big amount of chemistry or water will be on the wafer

Nesting dolls

The Other way around

Dynamism

Partial or excessive action

Loss or waste of energy that does not contribute to any of the useful functions being performed.  Inefficiency.  Can be partial or complete, permanent or temporary.

Loss of energy

Unpredictably high cost of the process due to the usage of big amount of chemistry or water for rinsing

The extent to which a user is able to learn how to operate, operate or control a system or object.  The convenience of use.

Ease of operation

Local quality

Anti-weight

Self-service

Pneumatics or hydraulics

Component: Filter

The time that an object or system takes to perform an action.  The action may take place over a few milliseconds, or over several years or more.  The parameter is different from 'reliability' (Parameter 35) which is connected to the idea of the time to failure of a system – where it is specifically only the time duration aspect that is at issue.  'Moving' includes any situation where there is any degree of relative motion between two or more parts related to the problem.  The relative motion may be a few microns or considerable distances.

Duration of action by a moving object

Defects remain on the wafer surface after the wet cleaning process step

Because the wet process does not remove the defects

Defects remain on the wafer till the very end of the process.

The chemistry is removed from the wafer before it removes the defects

Because the chemistry contaminates the wafer due to impurities or other properties

Try to eliminate the washing. Do we really need this?

To increase the density of the chemistry by temperature reduction.

Ensure that the chemistry remains on the wafer as long as possible (reduce rotation of the wafer)

Reduce evaporation rate of the chemistry, reduce rotation of the wafer

5+ WHYS Analysis

Increase the temperature of rinsing water

Defects remain on the wafer surface. The wet cleaning process suddenly becomes ineffective.Let's apply the Effective Brainstorming (EBS) tool to generate ideas and prioritize them.

To analyze why the defects remain on the wafer while cleaning with chemistry.The process is as follows:<ul><li>a wafer is kept in the special chuck in 4 points</li><li>chemistry pores from the nozzle on the wafer</li><li>the wafer rotates allows removing the chemistry from the wafer together with the defects</li><li>parameters of the process - chemistry flow, temperature, process time, wafer rotation rate and so on can be adjusted</li></ul>

Functional Modeling using AI

During the loading, the lowest thermocouple received the wrong information; therefore, the bottom part of the furnace became overheated.

The quality of the low-zone wafers is different from the mid-zone and top-zone wafers. For instance, the stoichiometry of SiO2 might change. Even small variations of stoichiometry can result in the same change in optical constants that may affect the model of ellipsometric model and result in SiO2 thickness.

Turn off the heaters of the furnace when the boat is removed. The furnace is big enough to keep the temperature for a long time. Besides, the STABILIZATION step is long enough to compensate for the temperature difference.

Use a mixture of N2 and Ar during LOADING to ensure that all residual air is moved out, even from the bottom zone of the furnace.

Disconnect the thermocouples control during the LOADING if the furnace is turned on.

Start N2 flow just before the LOADING, before the loading of the boat with wafers into the furnace. Turn on the heaters only when the boat is completely loaded into the furnace

Turn off the heaters of the furnace and N2 flow during PRE-LOADING - loading the wafers in the boat

During the PRE-LOADING - loading wafers into the boat, the furnace remains open, resulting in losing N2 gas and electricity. It would be better to cover the bottom of the furnace.

The process is related to microelectronics - microchip manufacturing.

The purpose of the process is to create a SiO2 layer on the surface of a Si wafer.
Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface.
Process: The oxidation occurs on the front side and on the back side of the wafer
Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer

Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

SiO2 thin film creation in Diffusion furnace - Process Functional Modeling

Diffusion furnace - Process Functional Modeling (PFM)

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Boat is empty</li><li>Wafers are in the FOUP (box for keeping and moving the wafers)</li><li>Robot picks the wafers from the FOUP and loads them into the boat</li></ul>The operation's main purpose is loading the wafers into the boatProduct - Wafers

PRE-LOADING - Loading wafers to boat

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the boat</li><li>Elevator moves the boat with wafers into the furnace</li></ul>The operation's main purpose is to load the boat with wafers into the furnaceProduct - Boat

LOADING - Loading boat to furnace

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters keep the process temperature</li><li>Atmosphere - N2 is kept within the closed furnace</li><li>Boat keeps wafers</li></ul>The operation's main purpose is to achieve an equal temperature within the furnace, to keep the wafers at the same temperature. Product - Wafers within the furnace

STABILIZATION - Dwelling & Temp increase

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters keep the process temperature</li><li>Atmosphere - N2 is kept within the closed furnace</li><li>Boat keeps wafers</li><li>O2 is supplied to the furnace to ensure the interaction with wafers to create a SiO2 thin layer on the surface of the wafer.</li></ul>The operation's main purpose is to create SiO2 layerProduct - SiO2 layer

OXIDATION - O2 added

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters reduce the temperature down to 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the boat</li><li>Elevator moves the boat with wafers down out of the furnace</li></ul>The operation's main purpose is to load the boat with wafers into the furnaceProduct - Boat

UNLOADING - Boat down from furnace

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the Boat</li><li>Robot picks the wafers from the boat and loads them into the FOUP</li></ul>The operation's main purpose is loading the wafers into the FOUPProduct - Wafers

COOLING & WAFERS UNLOADING

The thickness of the SiO2 thin film is measured using the ellipsometry method. The scheme of the measurements is shown below (the image was taken from <a href="https://www.sciencedirect.com/topics/chemistry/ellipsometry" rel="noopener noreferrer" target="_blank">the article</a>):<img 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">The purpose of the operation is to generate a signal within the detector.The product of the operation is the Detector.

SiO2 THICKNESS MEASUREMENT

Process Functional Modeling

Consider alternative chamber/process architectureA more radical solution is to redesign the process so the wafer is processed face down toward a shallow liquid bath. This could improve wetting, reduce air trapping, and reduce evaporation. A shallow bath may also allow fast replacement of chemistry and rinse water while keeping the wafer continuously covered by liquid.

Prevent bubble formation and air trappingThe dispense sequence should avoid trapping air between the liquid and the wafer surface. Liquid should contact the wafer smoothly and continuously, especially in patterned areas and high-aspect-ratio features.

Improve wafer wetting at the beginning of the processThe process should ensure complete replacement of air by liquid. Possible actions include pre-wet steps, lower initial rotation speed, temporary stop of wafer rotation during first dispense, optimized nozzle position, improved dispense profile, and chemical additives that improve wetting.

Reduce evaporation of chemistry and DI waterEvaporation can be reduced by controlling chamber atmosphere, humidity, pressure, temperature, exhaust rate, and process timing. The goal is to prevent the liquid film from drying too early and leaving residues or particles behind.

Control airflow inside the chamberAirflow should not directly disturb the liquid film on the wafer. Instead of simply increasing airflow, it should be minimized, redirected, or isolated from the wafer surface while still maintaining safe vapor removal.

This project applies Functional Modeling to analyze the single-wafer wet etch process in semiconductor manufacturing. The model shows that wet etch defects are not caused only by chemistry, but also by interactions between the wafer, liquid flow, air, rotation, rinsing, drying, drain, and chamber environment. Key challenges include incomplete wetting, trapped air or bubbles, residue and particle redeposition, evaporation-driven watermarks, and contamination during rinse or drying. The project identifies improvement directions such as better wafer pre-wetting, controlled airflow, reduced evaporation, optimized rinse and drying conditions, and alternative chamber concepts such as face-down processing in a shallow liquid bath.

Functional Modeling of Wet Etch at Semiconductor Manufacturing

Dry etch is one of the key pattern-transfer processes in semiconductor manufacturing. It is used to create vias, trenches, contact holes, and other micro- and nanoscale structures in dielectric, metal, or semiconductor layers. Unlike wet etching, dry etching uses plasma chemistry and ion bombardment, which allows better control of feature shape, directionality, and critical dimensions.In a typical silicon oxide dry etch process, the wafer is coated with a sacrificial light-absorbing material and photoresist, which define the pattern. The wafer is placed in a plasma etch chamber. Fluorine-containing plasma species interact with exposed SiO₂ and convert it into volatile products, mainly SiF₄, which are removed by the vacuum system. At the same time, ion bombardment assists the reaction, removes passivation or polymer from the feature bottom, and helps form vertical vias or trenches.Two coupled mechanisms control the process:Chemical etching — reactive radicals convert SiO₂ into volatile reaction products. Mechanical / ion-assisted etching — accelerated ions activate the surface, improve directionality, and remove material or polymer from the feature bottom.The main challenge is that the same mechanisms that enable etching can also create defects. Plasma exposure can heat and erode the resist and sacrificial layers, generating water-containing and carbon-containing by-products. SiF₄ may react with moisture and form silicon-oxide or silicon-oxyfluoride particles. Excessive ion bombardment can sputter fragments from the wafer, mask, chamber parts, or focus ring, leading to redeposition, micromasking, residues, blocked vias, or underetched features.Therefore, the goal of this project is to build a functional model of the dry etch system, identify useful and harmful interactions, and understand how process parameters such as plasma source power, bias power, gas chemistry, pressure, temperature, pumping efficiency, and overetch time affect defect formation. The model will help reveal process contradictions and generate practical guidance to reduce particles and residues while maintaining etch rate, profile control, and process stability.

<h2>Improve monitoring and feedback</h2><ol><li data-list="bullet">Track particle count versus source power and bias power.</li><li data-list="bullet">Monitor chamber moisture level.</li><li data-list="bullet">Monitor endpoint and overetch time.</li><li data-list="bullet">Compare defects before and after purge or pulsed steps.</li><li data-list="bullet">Use wafer maps to identify whether particles are center, edge, pattern, or chamber related.</li><li data-list="bullet">Track chamber age, clean count, focus-ring age, and ESC condition.</li></ol>Purpose: move from fixed recipe control to mechanism-based defect control.

<h2>Manage polymer formation</h2><ol><li data-list="bullet">Optimize fluorocarbon gas ratio.</li><li data-list="bullet">Avoid excessive polymer deposition.</li><li data-list="bullet">Use controlled O₂ addition if compatible with profile and selectivity.</li><li data-list="bullet">Keep polymer on sidewalls, but prevent polymer accumulation on the wafer top, chamber parts, and via bottom.</li><li data-list="bullet">Add a gentle polymer-removal step before overetch.</li></ol>Purpose: polymer should protect the sidewall, not become a particle source.

<h2>Reduce sputtering sources</h2><ol><li data-list="bullet">Lower bias power where possible.</li><li data-list="bullet">Reduce Ar or other heavy-ion contribution if sputtering is excessive.</li><li data-list="bullet">Use softer overetch conditions.</li><li data-list="bullet">Optimize focus-ring material and condition.</li><li data-list="bullet">Check chamber coating erosion.</li><li data-list="bullet">Reduce mask, resist, and SLAM erosion.</li><li data-list="bullet">Improve chamber seasoning stability.</li><li data-list="bullet">Replace worn chamber parts before they become particle sources.</li></ol>Purpose: prevent physical fragments from becoming micromasks or redeposited particles.

<h2>Split the recipe into functional steps</h2>Instead of one aggressive etch recipe, use a multi-step recipe:<ol><li data-list="ordered">Pre-dry / stabilization step</li><li data-list="ordered"> remove moisture and stabilize chamber conditions.</li><li data-list="ordered">Main chemical etch step</li><li data-list="ordered"> sufficient source power, moderate bias.</li><li data-list="ordered">By-product evacuation step</li><li data-list="ordered"> purge or low-power plasma to remove SiF₄ and fragments.</li><li data-list="ordered">Controlled bottom-clean step</li><li data-list="ordered"> short bias-assisted step to clear the via/trench bottom.</li><li data-list="ordered">Gentle overetch step</li><li data-list="ordered"> lower bias and lower sputtering risk.</li></ol>Purpose: each step performs one main function instead of creating competing effects.

<h2>Use pulsed plasma or pulsed bias</h2><ol><li data-list="bullet">Pulse the source generator to reduce continuous by-product generation.</li><li data-list="bullet">Pulse the bias generator to reduce continuous ion damage.</li><li data-list="bullet">Use high-bias short pulses only when bottom clearing is needed.</li><li data-list="bullet">Add low-power intervals to allow product evacuation.</li><li data-list="bullet">Test duty cycle, pulse frequency, and pulse timing.</li></ol>Purpose: separate “etching” and “evacuation” in time, instead of forcing the system to do everything continuously.

<h2>Balance source power and bias power</h2><ol><li data-list="bullet">Use source power mainly to control chemical etch rate.</li><li data-list="bullet">Use bias power only as much as needed for anisotropy and bottom clearing.</li><li data-list="bullet">Avoid the combination of very high source power and very high bias power.</li><li data-list="bullet">Reduce bias during overetch.</li><li data-list="bullet">Increase chemical etch contribution while reducing excessive sputtering.</li><li data-list="bullet">Build a process window based on particle count versus source/bias settings.</li></ol>Purpose: keep chemical removal efficient while preventing sputter-generated defects.

<h2>Improve removal of volatile by-products</h2><ol><li data-list="bullet">Increase pumping efficiency during main etch.</li><li data-list="bullet">Optimize chamber pressure to reduce residence time of SiF₄.</li><li data-list="bullet">Increase gas flow or improve gas-flow uniformity.</li><li data-list="bullet">Add purge steps between etch stages.</li><li data-list="bullet">Avoid dead zones where SiF₄ and moisture can accumulate.</li><li data-list="bullet">Improve exhaust conductance.</li><li data-list="bullet">Reduce unnecessary overetch time.</li></ol>Purpose: remove SiF₄ and other reaction products before they react, condense, or redeposit.

<h2>Reduce moisture to prevent SiF₄ hydrolysis</h2><ol><li data-list="bullet">Improve wafer dehydration bake before etch.</li><li data-list="bullet">Optimize resist and SLAM bake to remove absorbed water.</li><li data-list="bullet">Minimize wafer queue time after wet processing or coating.</li><li data-list="bullet">Keep wafers in dry N₂ environment before etch.</li><li data-list="bullet">Improve chamber pump-down and pre-etch purge.</li><li data-list="bullet">Check gas-line moisture contamination.</li><li data-list="bullet">Improve chamber wall temperature control to avoid condensation.</li><li data-list="bullet">Add a short pre-clean / pre-dry plasma step before the main etch.</li></ol><h2>Purpose: reduce H₂O availability so SiF₄ cannot convert back into SiO₂-containing </h2>

This project investigates particle-defect formation during SiO₂ dry etch. Functional modeling revealed that defects can be generated by two coupled mechanisms: chemical formation of SiO₂/SiOFₓ particles from SiF₄ interaction with moisture, and mechanical generation of particles by excessive ion bombardment and sputtering. The proposed improvement direction is to balance chemical etching and ion-assisted etching by properly adjusting the source and bias generators, reducing moisture, improving by-product evacuation, minimizing sputtering, and using pulsed or multi-step process recipes. The goal is to reduce particles and micromasking while maintaining etch rate, profile control, and process stability.

Functional Modeling of Dry Etch at Semiconductor Manufacturing

Functional Modeling of Dry Etch Process at Semiconductor Manufacturing

To increase the removal rate, elevate the concentration of H2O2, but also enhance the polish rate - increase the rotation rate and abrasive particles concentration.

Increase the concentration of the abrasive particles - so, the elevation of the concentration of H2O2 should be accompanied by an increase in the concentration of the abrasive particles

Increase the rotation of the pad - increase the polish rate

This project investigates how to increase the copper removal rate during Chemical Mechanical Planarization (CMP). Functional modeling revealed that increasing H₂O₂ alone is ineffective beyond an optimum level because rapid oxidation creates a thick, passivating Cu₂O/CuO layer that must be mechanically removed. The winning direction is to balance faster oxidation with stronger mechanical removal by optimizing pad speed, abrasive concentration, pressure, conditioning, and slurry transport.

Increase the removal rate of Cu at CMP

Mechanics substitution

Discarding and recovering

Component: H2O2 solution

The internal or external contour or profile of a component or system as required for ergonomic and function rather than aesthetic reasons

13 results in all PRIZ Hub topics