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Updated 01/25/2023
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Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.

Updated 01/17/2023
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The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

Updated 12/17/2022
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A good example of how to use 40 Inventive Principles for ideas generation.

Updated 12/2/2022
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The vacuum cleaner problem is an excellent example showing how to manage and resolve excursion - unexpected deviation from normal operation. Read, learn and use the platform for resolving of your excursions.

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Updated 11/1/2022
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An example of how to make task prioritization with Urgency - Important Matrix (UMI) using the PRIZ Innovation Platform