Define the more contaminated areas and spend more time/chemical to clean the specific areas

Increase the temperature of the solution to make the process more effective

Principle #15 – Dynamism – change an object from rigid to movable or adaptiveThe idea that is generated is as follows:Replace the constant flow of the chemistry with variable flow, especially in the and of the process, to ensure defects removal from the disc.So, the idea is to change (even make pulses) flow while the cleaning process.

לטבול את הצלחת במים במקום לשטוף אותה בכל פעם

מערכת כיווון אוטמיטת למסוע

The wafer is contaminated not equally. Use special cleaning on the areas that are more contaminated

The general conclusion is to eliminate the system of the air supply and exhaust. Let air enter the chamber and convert exhaust to drain with very little under-pressure. The will stabilize the performance, reduce the cost and make the system more simple.

Principle #16 – Partial or accessive action – do slightly more or slightly lessIf 100 percent of an object is hard to achieve using a given solution method then, by using 'slightly less' or 'slightly more' of the same method, the problem may be considerably easier to solve.A wafer is not contaminated equally: there are some areas with more defects and some areas with fewer amount of defectsThe idea is to use the shower with a graduated flow - the more the defects the higher the flow

Principle #13 – The other way around – Turn the object “upside-down”This is a great tip. Indeed, why the disk is kept “face-up” during the washing process?It would be much better to keep the disc “face down” to improve the removal of the defects from the surface.So, the idea is to keep the wafer “face down” during the washing process﻿<img 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">

Increase the pressure in the chamber

Prevent evaporation of the chemistry from the wafer

To increase the density of the chemistry by temperature reduction

Try to eliminate the wasting. Do we really need this?

Improve the rinsing process to ensure the defects removal

Improve the process to enhance the effectiveness of the cleaning with the chemistry

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process.
Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing.
The project is dedicated to the failure analysis and creation of innovative solutions.

Wafer cleaning issues at the wet process

Projects related to innovations and problem solving in the microchip manufacturing

Wafer cleaning issues in the wet process

Anything related to the cubic measure of space occupied by an object or the space around it.   'Moving' includes any situations where there is any degree of relative motion or mobility between two or more parts related to the problem.  This relative motion may be a few microns or a considerable distance.

Volume of moving object

Big amount of chemistry or water will be on the wafer

Nesting dolls

The Other way around

Dynamism

Partial or excessive action

Loss or waste of energy that does not contribute to any of the useful functions being performed.  Inefficiency.  Can be partial or complete, permanent or temporary.

Loss of energy

Unpredictably high cost of the process due to the usage of big amount of chemistry or water for rinsing

The extent to which a user is able to learn how to operate, operate or control a system or object.  The convenience of use.

Ease of operation

Local quality

Anti-weight

Self-service

Pneumatics or hydraulics

Component: Filter

The time that an object or system takes to perform an action.  The action may take place over a few milliseconds, or over several years or more.  The parameter is different from 'reliability' (Parameter 35) which is connected to the idea of the time to failure of a system – where it is specifically only the time duration aspect that is at issue.  'Moving' includes any situation where there is any degree of relative motion between two or more parts related to the problem.  The relative motion may be a few microns or considerable distances.

Duration of action by a moving object

Defects remain on the wafer surface after the wet cleaning process step

Because the wet process does not remove the defects

Defects remain on the wafer till the very end of the process.

The chemistry is removed from the wafer before it removes the defects

Because the chemistry contaminates the wafer due to impurities or other properties

Try to eliminate the washing. Do we really need this?

To increase the density of the chemistry by temperature reduction.

Ensure that the chemistry remains on the wafer as long as possible (reduce rotation of the wafer)

Reduce evaporation rate of the chemistry, reduce rotation of the wafer

5+ WHYS Analysis

Increase the temperature of rinsing water

Defects remain on the wafer surface. The wet cleaning process suddenly becomes ineffective.Let's apply the Effective Brainstorming (EBS) tool to generate ideas and prioritize them.

To analyze why the defects remain on the wafer while cleaning with chemistry.The process is as follows:<ul><li>a wafer is kept in the special chuck in 4 points</li><li>chemistry pores from the nozzle on the wafer</li><li>the wafer rotates allows removing the chemistry from the wafer together with the defects</li><li>parameters of the process - chemistry flow, temperature, process time, wafer rotation rate and so on can be adjusted</li></ul>

Functional Modeling using AI

To redesign the pins from straight and vertical, they could be spherical or tilted

Some parts of the pedestal can be made flexible

Perform the process in vacuum to avoid atmosphere flow

Maybe keep the wafer with a vacuum to avoid any movement of the wafer

Wafer moves within the chamber during the flash heating

Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage

Wafer breakage at flash heating

The internal or external contour or profile of a component or system as required for ergonomic and function rather than aesthetic reasons

Shape

Preliminary action

Spheroidality - Curvature

Flexible shells and thin films

Composite materials

The extent to which an object is able to resist changing in response to force.  Resistance to breaking.  Can mean elastic limit, plastic limit, or ultimate strength; tensile or compressive; linear or rotational.  Also includes toughness and hardness.

Strength

Component: Centering pins

The pedestal has a special configuration: the wafer moves and can get a mechanical hit

Wafer moves due to air pressure difference appearing due to flash heating

Fixate the wafer - no movements at all (vacuum chuck?)

Run additional wafers to compensate for the broken wafers

Redesign the pedestal or add a ring having no "walls" - no parts that the wafer can hit

Redesign the pedestal to exclude a mechanical hit

Flash heating is needed for implant ions activation

Different temperatures cause different pressures of nitrogen

Rapid thermal expansion of chamber gases inducing convective currents

The wafer should move during the flash heating process

Mechanical hit of the wafer with centring pins

Wafer got a mechanical hit during the flash heating process

Redesign centering pins with flexible, low-friction polymer coatings or spring-loaded tips that absorb minor impacts and allow self-centering without causing damage during wafer movement.

Redesign the quartz pedestal with additional low-profile support ridges or pins positioned to provide lateral stability to the wafer, preventing displacement from gas flows while maintaining uniform light exposure.

Process in a vacuum or at least in low pressure

Add the same flight on the bottom to get the same temperature

Integrate in-situ plasma-assisted activation during implantation to partially activate ions, reducing the reliance on subsequent high-temperature flash heating steps.

During the loading, the lowest thermocouple received the wrong information; therefore, the bottom part of the furnace became overheated.

The quality of the low-zone wafers is different from the mid-zone and top-zone wafers. For instance, the stoichiometry of SiO2 might change. Even small variations of stoichiometry can result in the same change in optical constants that may affect the model of ellipsometric model and result in SiO2 thickness.

Turn off the heaters of the furnace when the boat is removed. The furnace is big enough to keep the temperature for a long time. Besides, the STABILIZATION step is long enough to compensate for the temperature difference.

Use a mixture of N2 and Ar during LOADING to ensure that all residual air is moved out, even from the bottom zone of the furnace.

Disconnect the thermocouples control during the LOADING if the furnace is turned on.

Start N2 flow just before the LOADING, before the loading of the boat with wafers into the furnace. Turn on the heaters only when the boat is completely loaded into the furnace

Turn off the heaters of the furnace and N2 flow during PRE-LOADING - loading the wafers in the boat

During the PRE-LOADING - loading wafers into the boat, the furnace remains open, resulting in losing N2 gas and electricity. It would be better to cover the bottom of the furnace.

The process is related to microelectronics - microchip manufacturing.

The purpose of the process is to create a SiO2 layer on the surface of a Si wafer.
Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface.
Process: The oxidation occurs on the front side and on the back side of the wafer
Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer

Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

SiO2 thin film creation in Diffusion furnace - Process Functional Modeling

Diffusion furnace - Process Functional Modeling (PFM)

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Boat is empty</li><li>Wafers are in the FOUP (box for keeping and moving the wafers)</li><li>Robot picks the wafers from the FOUP and loads them into the boat</li></ul>The operation's main purpose is loading the wafers into the boatProduct - Wafers

PRE-LOADING - Loading wafers to boat

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the boat</li><li>Elevator moves the boat with wafers into the furnace</li></ul>The operation's main purpose is to load the boat with wafers into the furnaceProduct - Boat

LOADING - Loading boat to furnace

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters keep the process temperature</li><li>Atmosphere - N2 is kept within the closed furnace</li><li>Boat keeps wafers</li></ul>The operation's main purpose is to achieve an equal temperature within the furnace, to keep the wafers at the same temperature. Product - Wafers within the furnace

STABILIZATION - Dwelling & Temp increase

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters keep the process temperature</li><li>Atmosphere - N2 is kept within the closed furnace</li><li>Boat keeps wafers</li><li>O2 is supplied to the furnace to ensure the interaction with wafers to create a SiO2 thin layer on the surface of the wafer.</li></ul>The operation's main purpose is to create SiO2 layerProduct - SiO2 layer

OXIDATION - O2 added

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters reduce the temperature down to 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the boat</li><li>Elevator moves the boat with wafers down out of the furnace</li></ul>The operation's main purpose is to load the boat with wafers into the furnaceProduct - Boat

UNLOADING - Boat down from furnace

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the Boat</li><li>Robot picks the wafers from the boat and loads them into the FOUP</li></ul>The operation's main purpose is loading the wafers into the FOUPProduct - Wafers

COOLING & WAFERS UNLOADING

The thickness of the SiO2 thin film is measured using the ellipsometry method. The scheme of the measurements is shown below (the image was taken from <a href="https://www.sciencedirect.com/topics/chemistry/ellipsometry" rel="noopener noreferrer" target="_blank">the article</a>):<img 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">The purpose of the operation is to generate a signal within the detector.The product of the operation is the Detector.

SiO2 THICKNESS MEASUREMENT

Process Functional Modeling

Wafer final test data indicates a radial performance variation: dies closer to the wafer center tend to be faster, while dies nearer the wafer edge tend to be slower. The submitted investigation ties this pattern to a matching increase in RC-delay toward the wafer perimeter, suggesting the speed split is not random but systematic across the wafer radius. The issue is framed as a yield-loss problem with high urgency because it repeats radially across the wafer and can affect product binning and customer performance targets.
The leading explanation is that the PECVD CDO dielectric used in BEOL formation is not uniform from center to edge. The hypothesis is that the edge region experiences a different deposition environment — including gas flow, pumping, plasma sheath behavior, edge temperature, residence time, and radical concentration — because it is closer to the exhaust path. Under that condition, the CDO at the edge may become more oxide-like, denser, lower in carbon, and higher in dielectric constant, which would raise capacitance and increase RC-delay.
What is known so far is the existence of the radial trend in speed and RC-delay, plus a plausible process mechanism in the PECVD chamber. What remains uncertain is whether the dominant driver is capacitance variation alone or whether metal resistance also contributes materially, along with the exact radial profiles of thickness, carbon content, density, and dielectric constant. The investigation is therefore centered on radial process non-uniformity rather than on tuning only the average film behavior.
<h2>Symptoms</h2>
<ul>
<li>Slower processors/dies appear more frequently near the wafer edge.</li>
<li>Faster dies appear more frequently near the wafer center.</li>
<li>RC-delay increases toward the wafer edge.</li>
<li>There may also be higher deposition rate or different thickness at the edge, though this is not confirmed as the main issue.</li>
</ul>
<h2>Impact</h2>
<ul>
<li>Performance variation across dies from the same wafer.</li>
<li>Potential yield loss.</li>
<li>Risk to binning consistency and customer performance targets.</li>
<li>Recurrence appears systematic and radial rather than isolated.</li>
<li>Urgency is rated high.</li>
</ul>
<h2>Affected scope</h2>
<ul>
<li>PECVD CDO deposition for BEOL dielectric formation.</li>
<li>PECVD chamber.</li>
<li>Wafer edge / radial perimeter region.</li>
<li>Wafer-level processor dies and the CDO low-k dielectric film.</li>
</ul>
<h2>Hypotheses</h2>
<ul>
<li>The edge PECVD environment differs from the center due to gas flow, pumping, plasma sheath, temperature, residence time, and radical concentration.</li>
<li>The CDO at the edge is over-decomposed or more heavily oxidized, making it more oxide-like and higher-k.</li>
<li>The edge film may have higher deposition rate and/or different thickness, but the main issue is material property variation.</li>
<li>Metal resistance may also contribute to the observed RC-delay variation.</li>
</ul>
<h2>Assumptions</h2>
<ul>
<li>The wafer map trend reflects the underlying root cause rather than a coincidental correlation.</li>
<li>The edge CDO film property change is large enough to affect device speed.</li>
<li>BEOL RC-delay is a primary driver of the observed processor speed variation.</li>
</ul>
<h2>Unknowns and open questions</h2>
<ul>
<li>Exact wafer product and process node.</li>
<li>Measured k values, thickness, carbon content, porosity, and density across radius.</li>
<li>Whether metal resistance contributes materially alongside capacitance.</li>
<li>Which PECVD chamber settings or hardware features are currently in use.</li>
<li>Magnitude of the performance and yield impact.</li>
<li>What the radial profiles of CDO thickness, carbon content, density, and dielectric constant actually look like.</li>
<li>Is the RC-delay increase driven mainly by capacitance or also by interconnect resistance?</li>
<li>Which chamber parameters differ most between center and edge: gas ratio, RF coupling, chuck temperature, exhaust proximity, or residence time?</li>
<li>Can edge compensation or multi-zone tuning flatten the radial film property profile?</li>
<li>How large is the resulting speed bin split or yield impact across wafers?</li>
</ul>
<h2>Evidence</h2>
<ul>
<li>Measurement: speed score versus wafer radius shows faster dies closer to the center and slower dies closer to the edge.</li>
<li>Observation: dies from the same wafer can have different speeds, with neighboring dies also differing.</li>
<li>Measurement: RC-delay increases toward the wafer edge.</li>
<li>Observation: the wafer edge experiences a different process environment than the center because of gas flow, pumping, plasma, temperature, and residence-time differences.</li>
<li>Observation: the edge film may become more oxide-like, denser, lower in carbon, and higher in dielectric constant.</li>
<li>Other: proposed fixes include multi-zone showerhead, edge compensation ring, and edge plasma/temperature control to create intentional non-uniformity for uniform results.</li>
</ul>
<h2>Key links</h2>
<ul>
<li><a href="source:priznative">PRIZ-native investigation</a></li>
</ul>

<h2>Showerhead radial compensation</h2>Your idea about different hole sizes is very relevant.The showerhead is not only a gas distributor. In PECVD, it also influences plasma structure, local precursor delivery, oxidant delivery, residence time, and sometimes RF coupling. Patents and PECVD studies show that showerhead hole pattern, hole density, radial zones, and edge-flow design are used exactly to improve center-to-edge film uniformity and film propertiesBest concept:<blockquote>Multi-zone showerhead: center zone and edge zone with independently controlled flows.</blockquote>For example:<ol><li data-list="bullet">Center zone: normal CDO precursor + oxidant ratio</li><li data-list="bullet">Edge zone: slightly higher carbon precursor / lower oxidant ratio</li><li data-list="bullet">Outer ring purge: inert gas curtain to control edge plasma and residence time</li></ol>This is better than changing only the global precursor ratio.

<h2>Post-treatment compensation</h2>For porous CDO, UV cure or plasma cure can also create radial k variation.If edge k increases after cure, not during deposition, then the compensation should be in the cure:<ol><li data-list="bullet">radial UV intensity correction,</li><li data-list="bullet">wafer rotation during cure,</li><li data-list="bullet">edge masking / reduced edge exposure,</li><li data-list="bullet">temperature compensation during cure,</li><li data-list="bullet">optimized cure time to avoid edge over-densification.</li></ol>So first we need to know:<blockquote>Is edge k already high after deposition, or only after cure / integration?</blockquote>This is critical.

<h2>Pressure, gap, and pumping compensation</h2>Edge k can also come from different residence time and exhaust behavior.Try:<ol><li data-list="bullet">change chamber pressure,</li><li data-list="bullet">change showerhead-to-wafer spacing,</li><li data-list="bullet">tune throttle valve/pumping symmetry,</li><li data-list="bullet">add flow straighteners,</li><li data-list="bullet">use symmetric exhaust or compensated edge exhaust,</li><li data-list="bullet">reduce lateral gas flow along the wafer surface.</li></ol>A useful principle:<blockquote>If the edge composition is different, check whether the edge gas composition is different before it reaches the surface.</blockquote>

<h2>Chemistry ratio compensation: carbon/oxygen balance</h2>If edge k is high, one likely mechanism is:<blockquote>Edge receives relatively more oxidizing environment → lower carbon content → denser Si–O network → higher k</blockquote>So compensation could be:<ol><li data-list="bullet">lower O₂ / N₂O / CO₂ fraction globally or locally,</li><li data-list="bullet">increase organosilicon precursor at edge,</li><li data-list="bullet">increase porogen or carbon-rich precursor at edge,</li><li data-list="bullet">reduce oxidant dissociation near edge,</li><li data-list="bullet">use a less oxygen-aggressive chemistry.</li></ol>But global change may damage center performance. Therefore:<blockquote>Local chemistry compensation is better than global chemistry compensation.</blockquote>

<h2>RF/plasma radial compensation</h2>The edge often sees a different plasma sheath and radical flux. If the edge plasma is more aggressive, it may increase oxidation, remove carbon-containing groups, densify the film, or damage porous CDO.Possible directions:<ol><li data-list="bullet">tune RF frequency/power split,</li><li data-list="bullet">change electrode spacing,</li><li data-list="bullet">redesign edge ring,</li><li data-list="bullet">add plasma confinement ring,</li><li data-list="bullet">adjust showerhead-to-wafer gap,</li><li data-list="bullet">use pulsed plasma,</li><li data-list="bullet">reduce ion bombardment during the carbon-sensitive part of deposition.</li></ol>A very good process concept:<blockquote>Separate deposition and densification.</blockquote><blockquote> First deposit carbon-rich low-k film gently. Then apply controlled UV / plasma treatment more uniformly.</blockquote>This reduces the chance that the edge is over-treated during deposition.

<h2>Radial temperature compensation</h2>If the edge is hotter, the CDO may become denser, more oxide-like, less porous, and therefore higher-k.Possible solutions:<ol><li data-list="bullet">improve ESC thermal uniformity,</li><li data-list="bullet">tune backside He cooling zones,</li><li data-list="bullet">reduce edge-ring heating,</li><li data-list="bullet">modify edge ring material/emissivity,</li><li data-list="bullet">add multi-zone chuck control,</li><li data-list="bullet">reduce plasma heating near the edge.</li></ol>For CDO, temperature is important because it can affect carbon incorporation, densification, porogen behavior, moisture sensitivity, and final k.Strong idea:<blockquote>If edge k is higher because edge film is denser, compensate by lowering edge temperature or reducing edge plasma power density.</blockquote>

<h2>Edge gas ring/compensation ring</h2>A very practical concept is an independent edge gas ring around the showerhead or chamber wall.It could supply:<ol><li data-list="bullet">inert gas to dilute edge plasma,</li><li data-list="bullet">carbon-containing precursor to compensate carbon depletion,</li><li data-list="bullet">lower oxidant concentration near the edge,</li><li data-list="bullet">purge gas to reduce edge residence time.</li></ol>This gives a powerful control knob:<blockquote>Use the edge ring to tune only the last 10–20 mm of the wafer radius.</blockquote>This is useful because the edge problem is often localized.

<h2>Larger showerhead / extended edge coverage</h2>Increasing showerhead diameter can help if the current showerhead creates edge starvation or edge boundary distortion.If the gas distribution ends too close to the wafer edge, the edge region behaves like a boundary zone rather than a normal deposition zone. A larger showerhead, or an edge-compensated faceplate, can make the wafer edge “feel” more like the wafer center.Concept:<blockquote>Do not allow the wafer edge to see the end of the gas-distribution system. Move the gas-distribution boundary outside the wafer.</blockquote>This can reduce radial discontinuity in precursor flux, oxidant flux, and plasma density.

This project investigates radial non-uniformity of CDO low-k dielectric deposited by PECVD and its possible impact on wafer performance. Final test data indicate that faster dies are mainly located closer to the wafer center, while slower dies are more often found near the wafer periphery. The corresponding RC-delay trend also increases toward the wafer edge.

The focus of the project is the capacitance component of RC-delay. CDO is expected to provide a low dielectric constant between BEOL metal lines, but the deposited film may not have uniform properties across the wafer. Near the wafer edge, the process can be influenced by different gas flow, plasma behavior, residence time, temperature, and pumping conditions. This may lead to stronger oxidation and deeper precursor decomposition near the periphery, forming CDO that is more oxygen-rich, less carbon-rich, denser, and closer in behavior to SiO₂.

As a result, the dielectric constant k may increase toward the wafer edge, causing higher interline capacitance, higher RC-delay, and lower die speed.

The project uses Functional Modeling to understand how PECVD chamber components and process conditions affect CDO film properties. The goal is to identify the main functional and problematic interactions and propose directions for compensation, such as radial gas-flow tuning, multi-zone showerhead design, edge compensation flow, and local plasma or temperature control.

Radial CDO Non-Uniformity Causing Wafer Edge Speed Loss

Improve redeposition managementSince Ta atoms are sputtered in many directions, shields and chamber walls receive Ta redeposition. Their shape and replacement schedule should be part of the same model.

Use multi-zone magnetron controlIf possible, control several magnetic zones to redistribute plasma density and ion bombardment.

Pre-shape the Ta targetThis is closer to your compensation idea. Instead of heating, make the target initially thicker where erosion will be strongest. Then the target profile becomes more uniform during usage.

Use a variable magnetic-field profile during target lifeAt the beginning, use one racetrack position; later, shift it slightly inward or outward. This can spread erosion over more target area.

Change magnet configurationDesign the magnetron so that the plasma density is distributed over a wider area, not concentrated in one narrow ring.

Move or scan the magnetron fieldIf the racetrack is caused by magnetic field localization, then move the magnetic field during the target lifetime. The erosion zone will move, and Ta will be consumed more uniformly.

Temperature compensation is an interesting idea, but not the most practical solution for improving Ta target utilization.

This project investigates the nonuniform erosion of an expensive Ta sputtering target during Ta/TaN PVD. A deep racetrack groove forces target replacement while a significant amount of tantalum remains unused. Using PRIZ problem-solving tools, the project explores the system’s functions, identifies the root causes of localized erosion, and develops ways to improve target utilization without reducing deposition rate or production throughput.

Ta PVD Target Racetrack Erosion Reduces Target Utilization - Functional Modeling

Measured or perceived thermal condition of an object or system.  Includes other thermal parameters, such as heat capacity, conductivity, radiation, and convection.

Temperature

The field creation directs the Ar+ ions to the Ta sputtering target and releases Ta atoms

Periodic action

Blessing in disguise (Turn Lemons into Lemonade)

Color changes

Component: Magnetron

The field is concentrated between the V and S poles and does not provide equal heating of the Ta target.

13 results in all PRIZ Hub topics