During the loading, the lowest thermocouple received the wrong information; therefore, the bottom part of the furnace became overheated.

The quality of the low-zone wafers is different from the mid-zone and top-zone wafers. For instance, the stoichiometry of SiO2 might change. Even small variations of stoichiometry can result in the same change in optical constants that may affect the model of ellipsometric model and result in SiO2 thickness.

Turn off the heaters of the furnace when the boat is removed. The furnace is big enough to keep the temperature for a long time. Besides, the STABILIZATION step is long enough to compensate for the temperature difference.

Use a mixture of N2 and Ar during LOADING to ensure that all residual air is moved out, even from the bottom zone of the furnace.

Disconnect the thermocouples control during the LOADING if the furnace is turned on.

Start N2 flow just before the LOADING, before the loading of the boat with wafers into the furnace. Turn on the heaters only when the boat is completely loaded into the furnace

Turn off the heaters of the furnace and N2 flow during PRE-LOADING - loading the wafers in the boat

During the PRE-LOADING - loading wafers into the boat, the furnace remains open, resulting in losing N2 gas and electricity. It would be better to cover the bottom of the furnace.

The process is related to microelectronics - microchip manufacturing.

The purpose of the process is to create a SiO2 layer on the surface of a Si wafer.
Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface.
Process: The oxidation occurs on the front side and on the back side of the wafer
Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer

Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

SiO2 thin film creation in Diffusion furnace - Process Functional Modeling

Projects related to innovations and problem solving in the microchip manufacturing

Diffusion furnace - Process Functional Modeling (PFM)

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The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Boat is empty</li><li>Wafers are in the FOUP (box for keeping and moving the wafers)</li><li>Robot picks the wafers from the FOUP and loads them into the boat</li></ul>The operation's main purpose is loading the wafers into the boatProduct - Wafers

PRE-LOADING - Loading wafers to boat

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the boat</li><li>Elevator moves the boat with wafers into the furnace</li></ul>The operation's main purpose is to load the boat with wafers into the furnaceProduct - Boat

LOADING - Loading boat to furnace

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters keep the process temperature</li><li>Atmosphere - N2 is kept within the closed furnace</li><li>Boat keeps wafers</li></ul>The operation's main purpose is to achieve an equal temperature within the furnace, to keep the wafers at the same temperature. Product - Wafers within the furnace

STABILIZATION - Dwelling & Temp increase

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters keep the process temperature</li><li>Atmosphere - N2 is kept within the closed furnace</li><li>Boat keeps wafers</li><li>O2 is supplied to the furnace to ensure the interaction with wafers to create a SiO2 thin layer on the surface of the wafer.</li></ul>The operation's main purpose is to create SiO2 layerProduct - SiO2 layer

OXIDATION - O2 added

The conditions are as follows:<ul><li>Furnace is closed</li><li>Heaters reduce the temperature down to 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the boat</li><li>Elevator moves the boat with wafers down out of the furnace</li></ul>The operation's main purpose is to load the boat with wafers into the furnaceProduct - Boat

UNLOADING - Boat down from furnace

The conditions are as follows:<ul><li>Furnace is open</li><li>Heaters keep the temperature of 300C</li><li>Atmosphere - N2 flows from the top of the furnace down and comes out of the furnace</li><li>Wafers are in the Boat</li><li>Robot picks the wafers from the boat and loads them into the FOUP</li></ul>The operation's main purpose is loading the wafers into the FOUPProduct - Wafers

COOLING & WAFERS UNLOADING

The thickness of the SiO2 thin film is measured using the ellipsometry method. The scheme of the measurements is shown below (the image was taken from <a href="https://www.sciencedirect.com/topics/chemistry/ellipsometry" rel="noopener noreferrer" target="_blank">the article</a>):<img 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">The purpose of the operation is to generate a signal within the detector.The product of the operation is the Detector.

SiO2 THICKNESS MEASUREMENT

Process Functional Modeling

Define the more contaminated areas and spend more time/chemical to clean the specific areas

Increase the temperature of the solution to make the process more effective

Principle #15 – Dynamism – change an object from rigid to movable or adaptiveThe idea that is generated is as follows:Replace the constant flow of the chemistry with variable flow, especially in the and of the process, to ensure defects removal from the disc.So, the idea is to change (even make pulses) flow while the cleaning process.

לטבול את הצלחת במים במקום לשטוף אותה בכל פעם

מערכת כיווון אוטמיטת למסוע

The wafer is contaminated not equally. Use special cleaning on the areas that are more contaminated

The general conclusion is to eliminate the system of the air supply and exhaust. Let air enter the chamber and convert exhaust to drain with very little under-pressure. The will stabilize the performance, reduce the cost and make the system more simple.

Principle #16 – Partial or accessive action – do slightly more or slightly lessIf 100 percent of an object is hard to achieve using a given solution method then, by using 'slightly less' or 'slightly more' of the same method, the problem may be considerably easier to solve.A wafer is not contaminated equally: there are some areas with more defects and some areas with fewer amount of defectsThe idea is to use the shower with a graduated flow - the more the defects the higher the flow

Principle #13 – The other way around – Turn the object “upside-down”This is a great tip. Indeed, why the disk is kept “face-up” during the washing process?It would be much better to keep the disc “face down” to improve the removal of the defects from the surface.So, the idea is to keep the wafer “face down” during the washing process﻿<img 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">

Increase the pressure in the chamber

Prevent evaporation of the chemistry from the wafer

To increase the density of the chemistry by temperature reduction

Try to eliminate the wasting. Do we really need this?

Improve the rinsing process to ensure the defects removal

Improve the process to enhance the effectiveness of the cleaning with the chemistry

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process.
Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing.
The project is dedicated to the failure analysis and creation of innovative solutions.

Wafer cleaning issues at the wet process

Wafer cleaning issues in the wet process

Anything related to the cubic measure of space occupied by an object or the space around it.   'Moving' includes any situations where there is any degree of relative motion or mobility between two or more parts related to the problem.  This relative motion may be a few microns or a considerable distance.

Volume of moving object

Big amount of chemistry or water will be on the wafer

Nesting dolls

The Other way around

Dynamism

Partial or excessive action

Loss or waste of energy that does not contribute to any of the useful functions being performed.  Inefficiency.  Can be partial or complete, permanent or temporary.

Loss of energy

Unpredictably high cost of the process due to the usage of big amount of chemistry or water for rinsing

The extent to which a user is able to learn how to operate, operate or control a system or object.  The convenience of use.

Ease of operation

Local quality

Anti-weight

Self-service

Pneumatics or hydraulics

Component: Filter

The time that an object or system takes to perform an action.  The action may take place over a few milliseconds, or over several years or more.  The parameter is different from 'reliability' (Parameter 35) which is connected to the idea of the time to failure of a system – where it is specifically only the time duration aspect that is at issue.  'Moving' includes any situation where there is any degree of relative motion between two or more parts related to the problem.  The relative motion may be a few microns or considerable distances.

Duration of action by a moving object

Defects remain on the wafer surface after the wet cleaning process step

Because the wet process does not remove the defects

Defects remain on the wafer till the very end of the process.

The chemistry is removed from the wafer before it removes the defects

Because the chemistry contaminates the wafer due to impurities or other properties

Try to eliminate the washing. Do we really need this?

To increase the density of the chemistry by temperature reduction.

Ensure that the chemistry remains on the wafer as long as possible (reduce rotation of the wafer)

Reduce evaporation rate of the chemistry, reduce rotation of the wafer

5+ WHYS Analysis

Increase the temperature of rinsing water

Defects remain on the wafer surface. The wet cleaning process suddenly becomes ineffective.Let's apply the Effective Brainstorming (EBS) tool to generate ideas and prioritize them.

To analyze why the defects remain on the wafer while cleaning with chemistry.The process is as follows:<ul><li>a wafer is kept in the special chuck in 4 points</li><li>chemistry pores from the nozzle on the wafer</li><li>the wafer rotates allows removing the chemistry from the wafer together with the defects</li><li>parameters of the process - chemistry flow, temperature, process time, wafer rotation rate and so on can be adjusted</li></ul>

Functional Modeling using AI

To redesign the pins from straight and vertical, they could be spherical or tilted

Some parts of the pedestal can be made flexible

Perform the process in vacuum to avoid atmosphere flow

Maybe keep the wafer with a vacuum to avoid any movement of the wafer

Wafer moves within the chamber during the flash heating

Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage

Wafer breakage at flash heating

The internal or external contour or profile of a component or system as required for ergonomic and function rather than aesthetic reasons

Shape

Preliminary action

Spheroidality - Curvature

Flexible shells and thin films

Composite materials

The extent to which an object is able to resist changing in response to force.  Resistance to breaking.  Can mean elastic limit, plastic limit, or ultimate strength; tensile or compressive; linear or rotational.  Also includes toughness and hardness.

Strength

Component: Centering pins

The pedestal has a special configuration: the wafer moves and can get a mechanical hit

Wafer moves due to air pressure difference appearing due to flash heating

Fixate the wafer - no movements at all (vacuum chuck?)

Run additional wafers to compensate for the broken wafers

Redesign the pedestal or add a ring having no "walls" - no parts that the wafer can hit

Redesign the pedestal to exclude a mechanical hit

Flash heating is needed for implant ions activation

Different temperatures cause different pressures of nitrogen

Rapid thermal expansion of chamber gases inducing convective currents

The wafer should move during the flash heating process

Mechanical hit of the wafer with centring pins

Wafer got a mechanical hit during the flash heating process

Redesign centering pins with flexible, low-friction polymer coatings or spring-loaded tips that absorb minor impacts and allow self-centering without causing damage during wafer movement.

Redesign the quartz pedestal with additional low-profile support ridges or pins positioned to provide lateral stability to the wafer, preventing displacement from gas flows while maintaining uniform light exposure.

Process in a vacuum or at least in low pressure

Add the same flight on the bottom to get the same temperature

Integrate in-situ plasma-assisted activation during implantation to partially activate ions, reducing the reliance on subsequent high-temperature flash heating steps.

Use a belt with deposited piezoelectric material. Collect the dust on the belt and remove the dust from the belt due to the belt rotation

Use the piezoelectric plate as a collector of the dust due to electrostatic effect

To use the electrostatic effect to collect the dust

Use piezoelectric plate to generate electricity due to bending

Use the other way around - opposite - generate electricity when moving

Replace the battery for another device that generate energy when it is needed

Eliminate a battery - replace it for another source of energy

This project showcases how functional modeling can drive innovation by analyzing and simulating various versions of a vacuum cleaner. By studying the functional model, you will experience firsthand how the Functional Modeling creative thinking tool helps identify opportunities for improvement and generate innovative ideas for the next generation of products.

Through this example, you’ll learn how to dissect the functionality of a vacuum cleaner, revealing ways to enhance its performance, efficiency, and user experience—ultimately paving the way for future innovations.

Functional Modeling of a Vacuum Cleaner: A Pathway to Innovation

Projects dedicated to mechanical engineering

Vacuum cleaner Functional modeling

Taking Out (Extraction)

Universality

Discarding and recovering

The number of useful (value-adding) functions or operations performed by a system per unit time.  The time per unit function or operation.  Useful output per unit of time.  Cost per unit output, or amount of useful output.  (See 'Speed' –  #14 – which is more focused on issues of dynamics rather than the output of product.)

Productivity

The battery charges and supplies electricity for the DC motor

Periodic action

Any interaction that is intended to change an object's condition.  Can be linear or rotational; the term applies equally well to torque.

Force

Mechanical vibration

Copying

Parameter changes

System' Complexity – The number and diversity of elements and element interrelationships within and across the boundaries of a system.  The user may be an element of the system that increases the complexity.  Includes issues like the number of functions, number of interfaces and connections, excessive number of components.    'Control' Complexity – complexity of the control system – either physical components or the algorithms that it contains- used to control a system in delivering useful functions.

Device complexity

Battery consumes energy even without usage

The measure of an object's capacity for doing work.  This parameter focuses on the actual amount of energy (rather than the efficiency of its use, see 27).  'Moving' includes any situation where there is any degree of relative motion between two or more parts related to the problem.  The relative motion may be a few microns or larger amounts.

Use of energy by moving object

Equipotentiality

Mechanics substitution

The measure of an object's capacity for doing work.  This parameter focuses on the actual amount of energy (rather than the efficiency of its use, see 27).  'Stationary' includes any situation where there is no form of relative motion between two or more parts related to the problem.

Use of energy by stationary object

Porous materials

The amount, quantity, or a number of a system's materials, substances, parts, fields or sub-systems.  'Substance' is used in its most generic form in the TRIZ context to include any physical or temporal 'thing'.

Quantity of substance/the matter

Any linear or angular dimension relating to a stationary object.   'Stationary' includes any situations where there is no form of relative motion between two or more parts related to the problem.

Length of stationary object

Version: Basic version, Component: Wire

DC electricity to make the vacuum cleaner operate

Version: Wireless version, Component: Battery

Battery consumes energy even if no operation

Version: Innovative version, Component: Piezoelectric Plate

Version: Wireless version, Component: Filter

Stops dust and cleans the air coming from aerosols

Version: Basic version, Component: Filter

The velocity or speed of an object or the rate of any kind of process or action.  The speed may be relative or absolute, linear or rotational.

Speed

vzvbzgz

Insert the separation net near the wafer to reduce the diffusion of ions to the wafer - this is the way to reduce the rate of diffusion.

Begin the Cu deposition with the electroless process - ensure to increase the thickness of the Cu-seed layer, which will result in the reduction of the resistivity

Increase the voltage of the process to ensure the electroplating is in diffusion limitation mechanism - Increase the cathodic overpotential through refined voltage control in the plating recipe to enhance reaction kinetics without exceeding mass transport limits, ensuring uniform deposition across the wafer

Increase the electroplating bath temperature by 5-10°C to disproportionately accelerate the temperature-sensitive reaction kinetics compared to the diffusion process, reducing the kinetic limitation.

Implement pulsed current electrodeposition with tailored duty cycles and pulse frequencies to intermittently boost discharge kinetics while allowing diffusion to equilibrate, reducing the kinetic limitation under standard conditions

Reduce the diameter of the anode - a smaller size of the Cu anode should act similarly to the added dummy cathode.

Copper electroplating is essential for forming advanced semiconductor interconnects, yet radial thickness non-uniformity remains a costly challenge. Thicker deposition at the wafer edge and thinner copper at the center force manufacturers to rely on overplating and CMP compensation, increasing material waste and process cost.

Using the PRIZ Platform, this project reveals that the true amplification mechanism lies in operating within a kinetically controlled regime, where small voltage variations caused by seed-layer resistance produce large thickness deviations. By shifting the process closer to diffusion-controlled behavior and reducing sensitivity to voltage fluctuations, uniform deposition can be achieved intrinsically — enabling thinner seed layers, reduced overplating, lower CMP burden, and overall cost reduction.

Uniformity improvement at Cu-electroplating - PRIZ Analysis

Uniformity improvement at Cu-electroplating

Electrolyte composition and process conditions enhance Cu2+ ion mobility for fast diffusion, but do not accelerate cathodic reaction kinetics adequately

The process conditions provide too slow an electrical discharge and too fast diffusion

Diffusion of Cu(2+) ions occurs faster than the electrical discharge of the ion on the cathode

Cu electrodeposition reaction is kinetically controlled at standard overpotentials used in process

Current density controls the kinetics of Cu deposition reaction at the wafer surface - the deposition is controled on the kinetics part of the deposition process

The Cu-electrodeposition process strongly depends on the current density

The thin Cu seed layer has high sheet resistance, causing IR voltage drop with increasing distance from the bevel contact

Current density is higher at the periphery (near the contact on the bevel) and lower when far from the contact, in the mid and expecially central zone of the wafer

During electroplating, Cu is deposited more on the peripheral area that is near the electrical contact on the bevel and less on the mid and central area of the wafer

Cu layer is thicker on the periphery of the wafer and systematically thinner while moving from the periphery to the mid and central part of the wafer

Non-uniform deposition of Cu on the wafer during Cu-electroplating at the BEOL of semiconductor manufacturing

Optimize the seed layer deposition process to incorporate radial thickness grading, with slightly thicker Cu in the center via targeted PVD parameters, balancing overall thinness while countering the inherent current distribution bias during electroplating.

Incorporate radial electrolyte flow channels in the plating cell to create targeted convective enhancement at the wafer center, compensating for lower current density and promoting uniform ion supply without altering overall process conditions.

Pre-treat the wafer bevel with a localized conductive enhancement layer (e.g., via selective electroless deposition) to lower contact resistance and ensure even current injection across the periphery without altering the overall seed thickness.

Implement a rotating auxiliary electrode positioned symmetrically around the wafer, electrically isolated but capacitively coupled to dynamically average out peripheral current concentration during plating.

Incorporate a post-seed annealing step in a reducing atmosphere to recrystallize the Cu seed layer, reducing grain boundary scattering and lowering sheet resistance by 20-30% without increasing thickness.

Incorporate a conductive mesh or auxiliary cathode ring positioned conformally around the wafer periphery, biased to redistribute current evenly and minimize IR drops from the bevel contact without wasting material on non-productive surfaces.

Formulate the electrolyte with optimized concentrations of kinetic accelerators, such as bis(3-sulfopropyl) disulfide (SPS), to lower the activation energy of the Cu reduction reaction, making deposition less sensitive to local current density variations and shifting control toward mass transport.

Implement a pre-plating surface activation rinse using a dilute sulfuric acid or halide-containing solution to chemisorb species on the Cu seed layer, reducing the kinetic barrier for electron transfer and enabling faster reaction rates at existing overpotentials.

Increase the electroplating bath temperature by 5-10°C to disproportionately accelerate the temperature-sensitive reaction kinetics relative to diffusion, thereby reducing kinetic limitations.

Implement pulsed current electrodeposition with tailored duty cycles and pulse frequencies to intermittently boost discharge kinetics while allowing diffusion to equilibrate, reducing the kinetic limitation under standard conditions

Increase the cathodic overpotential through refined voltage control in the plating recipe to enhance reaction kinetics without exceeding mass transport limits, ensuring uniform deposition across the wafer

The wafer is connected to the electricity through the wafer bevel

Thin Cu seed layer exhibits high sheet resistance, increasing IR drop towards wafer center

More Cu deposites on the periphery and less on the central part of the wafer

Non-uniform layer of Cu deposits on sislicon wafer at Cu-electroplating

Enhance mass transport uniformity by integrating a radial flow impeller system that directs electrolyte preferentially toward the wafer center without increasing overall agitation energy.

Adopt pulsed current electroplating mode with tailored on-off cycles and amplitudes to reduce the effective IR drop across the seed layer, promoting more uniform deposition rates radially.

Design the seed layer with a slight radial thickness gradient (thicker toward center via masked PVD) to compensate for IR drop, ensuring average thickness remains thin for cost control.

Incorporate an auxiliary conductive mesh or foil overlay on the wafer bevel during plating to equalize potential across the seed layer without altering the seed thickness.

Copper electroplating is applied to fill all the structures on the silicon wafer during semiconductor manufacturing. The wafer is first covered with a thin Cu seed layer to enable electrical conductivity, allowing the application of potential across the wafer surface for the electrolysis of copper. Electrical contact is made at the wafer bevel, and the wafer is immersed in the electrolyte of the electroplating bath. The electroplating tool features a copper anode and the electrolyte solution, with the wafer serving as the cathode. The wafer rotates during the process to enhance hydrodynamics, and copper is deposited onto the wafer surface. The primary challenge is non-uniform deposition of the Cu layer, where the deposit is thicker at the periphery (near the edge) and thinner in the central zone of the wafer. This radial non-uniformity arises due to the thin seed layer's resistance, leading to higher current density and faster deposition near the bevel of the wafer, where the electrical path is shorter. In the mid and central area of the wafer, the IR drop increases, therefore the current density reduces. To perform CEC analysis, we can break down the chain: Start with the process parameters (thin Cu seed, bevel contact, rotation, electrolyte composition), identify intermediate effects (lateral current flow, IR drop), and trace to the root cause of non-uniformity, aiming to uncover opportunities for improvement without increasing costs or waste.

Projects solving problems in the software development world and related processes.

1359 results in all PRIZ Hub authors