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Guy Landman avatar
Name:
Guy Landman
Username:
guylan
Location:
Haifa
Organization:
Ben gurion university
Updated 07/16/2025
1
Project Poster | Wafer Bowing: Causes and Solutions by Guy Landman and Hila Haimov

To address the requirement for smaller and more powerful processors, innovative 3D packaging is developed, which involves stacking many layers vertically. This enhances performance but produces mechanical difficulties such as wafer bowing as a result of internal tension caused by thermal expansion mismatch. this problem has approached from a materials engineering perspective, investigating how material selection, layer thickness, and deposition conditions may minimize stress and prevent deformation.