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Updated 07/8/2025
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Wafer Bowing: Causes and Solutions by Guy Landman and Hila Haimov

Our Solution – CTE Matching Tool

We built a simple web tool that helps engineers reduce wafer bowing by selecting materials with matched thermal expansion (CTE).

The tool calculates the ΔCTE between each layer and the one below it, highlighting potential thermal stress in multilayer stacks.

Problem Solved:

There is a lack of easy simulation tools to assess thermal mismatch in semiconductor structures.

Goal:

Let engineers predict bowing early and make better material decisions.

Try it:

https://cteino.my.canva.site/dagqt3jubae

Future work

We plan to add layer thickness, since thicker layers cause more stress.

This will improve prediction accuracy and show the relative impact of each material on bowing.

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