Wafer Bowing: Causes and Solutions by Guy Landman and Hila Haimov
Build a validated material database for CTE and mechanical properties
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deposite on beavel (prephiry or sides) of the wafer can be used for deposition to counter the bowing
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trying to compansite bowing with adjusment the thinkness the layer ( with consideration of limits)
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Add buffer layers to absorb thermal mismatch
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Select materials with matched thermal expansion (CTE)
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stack two wafers back to back to prevent bowing and process both wafers and then seperate them
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because deposited layer is not stable and stressed due to deposition thermal annealing could be used to relieased stress
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Aluminum is common material used in the welding industry due to its suitable properties, Although aluminum welding generally has disadvantages. One of these weaknesses is the formation of porosity, which will affect the welded joint's mechanical properties. porosity is formed due to two mechanisms, shrinkage porosity caused by shrinkage during the metal solidification process and gas porosity caused by air trapping and undissolved hydrogen. The welding process often produces gases such as hydrogen, carbon dioxide and steam. During welding, the metal goes into a liquid state and then cools at a rapid rate. because In a liquid there is a higher solubility of a gas than in a solid, This may trap gases inside the material and create bubbles when the welding takes place. n order to minimize the problems with the porosity of the material due to welding, it is necessary to control the speed of the process, thermal gradient, dynamics of melt pool flow and solidification. Therefore, in order to solve this problem, we use laser beam welding.
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