The system:
Water that is used for washing high-purity products.
Failure:
Too many particles percent in the water
Possible solution:
Add a filter. The manager requested to add 10 nm filter to be in the sequence to the 100nm filter. It is expected that the proposed change will improve a particle performance
Real problem:
To define what is the real risk, create a model of the failure and generate a mitigation/failure prevention
Effective
Ineffective
Basic functions
Components
Supersystems
Water | 10 |
Filter 100nm | 6 6 |
H2O agglomerates | 6 24 |
H2O Molecules | 6 21 |
Particles | 4 |
Filter 10nm | 2 24 |
Fittings and all the parts of the system | 2 8 |
Pump | 2 |
Molecules of water create agglomerates having a size of tens mn. The number of free H2O molecules defines the water activity. The fine filter destroys the agglomerates and increases the number of free molecules H2O that increases the water activity - high interaction rate, high evaporation rate, etc. The elevated activity of the water may result in the dissolution and precipitation of new defects and particles. To ensure successful performance 40 Inventive principles should be enrolled to find a solution to the problem
If | If I use a very fine filter |
|---|---|
Then | The purity of the water will be improved - the water will be pure from particles |
But | The agglomerates of the water will be destroyed and the activity on the water will be increased |
Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.
This project applies Functional Modeling to analyze the single-wafer wet etch process in semiconductor manufacturing. The model shows that wet etch defects are not caused only by chemistry, but also by interactions between the wafer, liquid flow, air, rotation, rinsing, drying, drain, and chamber environment. Key challenges include incomplete wetting, trapped air or bubbles, residue and particle redeposition, evaporation-driven watermarks, and contamination during rinse or drying. The project identifies improvement directions such as better wafer pre-wetting, controlled airflow, reduced evaporation, optimized rinse and drying conditions, and alternative chamber concepts such as face-down processing in a shallow liquid bath.
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage