Water that is used for washing high-purity products.
Too many particles percent in the water
Add a filter. The manager requested to add 10 nm filter to be in the sequence to the 100nm filter. It is expected that the proposed change will improve a particle performance
To define what is the real risk, create a model of the failure and generate a mitigation/failure prevention
Molecules of water create agglomerates having a size of tens mn. The number of free H2O molecules defines the water activity. The fine filter destroys the agglomerates and increases the number of free molecules H2O that increases the water activity - high interaction rate, high evaporation rate, etc. The elevated activity of the water may result in the dissolution and precipitation of new defects and particles. To ensure successful performance 40 Inventive principles should be enrolled to find a solution to the problem
If I use a very fine filter
The purity of the water will be improved - the water will be pure from particles
The agglomerates of the water will be destroyed and the activity on the water will be increased
The project was dedicated to production yield improvement in microchip manufacturing. The bumps are created on the top of a wafer and used for the final test of all dies. Only good dies are taken for the packaging. All dies that fail the test will be scrapped. The process yield depends on the amount of "good" and "bad" dies. It was revealed that in some cases, the time between the end of the process and the final test impacts the yield. The longer the dwelling, the more dies fail the final test. If the dwelling exceeds hundreds of hours, the amount of failed dies becomes dramatically high, which results in the scrapping of the whole wafer. The problem was analyzed and solved.
Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage