Process description
The wet cleaning process is performed with single wafer equipment: one by one.
The wafer rotates, and the chemistry or rinsing water is poured from the nozzle to the central area of the wafer but can also move from the center to the periphery of the wafer.
Equipment:
Failure and possible trigger:
The new batch of chemistry is contaminated. The chemical content of the suspected batch does not match the typical composition of the chemistry.
The disadvantages of the traditional approach
A systematic approach is needed. Usage of creative thinking tools is necessary for the generation of innovative ideas
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage