Time-depending yield degradation at microchip manufacturing
Temporary solution:
Wash the wafers with water prior to the final test
Creative solution:
Use only wet processes and add makeup operation to fix the undercut
1 operation - remove Cu with Chem 1 but reduce the time (Process time - X)
2 operation - remove Ti with Chem 2 as usual
3 operation - makeup operation - remove overcut of the Cu with Chem 1 for the remaining time - time = X
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