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Updated 09/23/2023
2

Time-depending yield degradation at microchip manufacturing

Temporary solution:


Wash the wafers with water prior to the final test


Creative solution:


Use only wet processes and add makeup operation to fix the undercut


1 operation - remove Cu with Chem 1 but reduce the time (Process time - X)

2 operation - remove Ti with Chem 2 as usual

3 operation - makeup operation - remove overcut of the Cu with Chem 1 for the remaining time - time = X

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