Updated 09/21/2022

Wafer breakage at flash heating

One of the operations at the microchip processing is very fast heating - flash heating

The equipment is as follows:

A wafer is located on the bumps between the centering pins of the holder that is made from quartz. The holder is kept within the chamber. The heating is performed with light.

Botton lights keep a stable temperature while the upper aims to heat the wafer fast to reach about 1000C for about 1 sec.

Sometimes the process results in the wafer breakage which is a big problem: wafer scrap and the equipment contamination with the broken pieces

Find the root cause of the wafer breakage and create a solution of the problem.

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Updated 12/5/2022

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.

Anatoly Agulyansky