Wafer breakage at flash heating
One of the operations at the microchip processing is very fast heating - flash heating
The equipment is as follows:
A wafer is located on the bumps between the centering pins of the holder that is made from quartz. The holder is kept within the chamber. The heating is performed with light.
Botton lights keep a stable temperature while the upper aims to heat the wafer fast to reach about 1000C for about 1 sec.
Sometimes the process results in the wafer breakage which is a big problem: wafer scrap and the equipment contamination with the broken pieces
Find the root cause of the wafer breakage and create a solution of the problem.
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