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Updated 07/16/2024
11

Wafer breakage at flash heating

Model of the failure

The wafer flies and hits the pins due to the pressure differences that occur at flash.

Possible solutions

  1. Eliminate a wafer movement and flying - fixate a wafer with a vacuum chuck
  2. Eliminate the pressure difference - reduce the pressure, perform the process at low pressure
  3. Eliminate hit - redesign centering pins to avoid hitting of the wafer during its movement


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