Wafer breakage occurs at flash heating operation
No reasonable model of the wafer breakage that occurs at the flash heating operation
Exclude wafer breakage or at least reduce in ten times the number of affected wafers
Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.