Wafer breakage within the flash heating system:
The flash heating with the upper lamp created the gradient of the temperature of the air. The fast-changing of temperature results in the wind (tornado) formation that leads to the movement of the wafer. The moving of the wafer may result in a mechanical hit followed by the wafer breakage.
Wafer breakage occurs at flash heating
Run additional wafers to compensate for the broken wafers
A mechanical hit occurs
Redesign the pedestal or add a ring having no "walls" - no parts that the wafer can hit
Wafer moves due to air pressure difference appearing due to flash heating
Keep the wafer static - no movements at all (vacuum keeper?)
The pedestal has a special configuration: the wafer moves and can get a mechanical hit
Redesign the pedestal to exclude a mechanical hit
How wafer breakage occurs while the flash heating process:
The main conclusion is that we need to exclude either movement of the wafer or vertical solid parts that the wafer can hit
we exclude the wafer movement
no breakage will occur due to a mechanical hit
The thermal stress could appear and affect the parameters of the product or even result in breakage due to thermal stress
Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.