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Updated 02/22/2024
10

Wafer breakage at flash heating

Current situation

Wafer breakage occurs at flash heating operation

Disadvantages

  • Lost wafers - low yield
  • Tool contamination - long maintenance is required after the breakage
  • No clear and reasonable explanation (model) of the breakage exists
  • No clear directions for the process improvement to avoid (or at least) reduce the number of broken wafers

Problem statement

The current flash heating operation results in wafer breakage, leading to lost wafers and low yield, tool contamination requiring long maintenance, and a lack of clear explanation or model for the breakage, hindering process improvement.

Success criteria

Exclude wafer breakage or at least reduce in ten times the number of affected wafers

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