Updated 01/17/2023

SiO2 thin film creation in Diffusion furnace - Process Functional Modeling

Current situation

The thickness standard deviation (sigma) of SiO2 thin layer on the silicon wafer is high


The high standard deviation of the SiO2 thin layer on the silicon wafer is bad because it indicates that the layer is not uniform and that there are significant variations in the thickness across the wafer. This can lead to issues with the performance of the device and potential reliability issues.

Problem statement

The process conditions are different in the different zones of the furnace. Wafers in the low zone show worse performance.

Success criteria

Use Process Functional Modeling (PFM) to create a model of the process and a model of the failure. Generate a solution

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