Optimizing IC Interconnection: A Functional Approach to Innovation (Stay updated on the project's progress)
SYSTEM FUNCTIONAL MODEL
The first result from the System Functional Modeling of the structure is to replace the Ta barrier for the fine air gap:
Indeed, Fine Air Gap (FAG) can successfully replace the Ta-barrier layer. We do not need a thick gap, even a very fine gap is good enough to prevent Cu diffusion into ILD. The FAG purpose is to destroy an interphase boundary.
Fine air gap structure advantages:
- No Cu diffusion that can contaminate the ILD
- Air gaps can trap the voids that may be formed due to Cu-electromigration, generally, the electromigration in such configuration should be investigated and solved.
- Additional volume for metal lines
- Generally - possibility to reduce RC-delay
- Cost reduction - Ta is a very expensive material
PROCESS FUNCTIONAL MODEL (in process)
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