Wafer cleaning issues at the wet process
Principle #7 – Nesting dolls – place one object inside another.
The idea that is generated from this principle is as follows.
Why do we use only one single nozzle? Why not shower? The shower has several halls – a lot of nozzles. More than that, we can make halls with different diameters in the center and in the periphery of the shower to ensure equal coverage of the disc with the chemistry.
So, the idea is to replace the single nozzle with the shower
11
Principle #13 – The other way around – Turn the object “upside-down”
This is a great tip. Indeed, why the disk is kept “face-up” during the washing process?
It would be much better to keep the disc “face down” to improve the removal of the defects from the surface.
So, the idea is to keep the wafer “face down” during the washing process
9
Principle #15 – Dynamism – change an object from rigid to movable or adaptive
The idea that is generated is as follows:
Replace the constant flow of the chemistry with variable flow, especially in the and of the process, to ensure defects removal from the disc.
So, the idea is to change (even make pulses) flow while the cleaning process.
6
Principle #16 – Partial or accessive action – do slightly more or slightly less
If 100 percent of an object is hard to achieve using a given solution method then, by using 'slightly less' or 'slightly more' of the same method, the problem may be considerably easier to solve.
A wafer is not contaminated equally: there are some areas with more defects and some areas with fewer amount of defects
The idea is to use the shower with a graduated flow - the more the defects the higher the flow
5
The general conclusion is to eliminate the system of the air supply and exhaust. Let air enter the chamber and convert exhaust to drain with very little under-pressure. The will stabilize the performance, reduce the cost and make the system more simple.
3
Improve the process to enhance the effectiveness of the cleaning with the chemistry
1
Improve the rinsing process to ensure the defects removal
0
Try to eliminate the wasting. Do we really need this?
0
To increase the density of the chemistry by temperature reduction
0
Prevent evaporation of the chemistry from the wafer
0
Increase the pressure in the chamber
0
The wafer is contaminated not equally. Use special cleaning on the areas that are more contaminated
0
Similar projects
Semiconductor devices are becoming more complex and expensive. But what exactly are we paying for when we buy a computer, cellphone, or any device containing a microchip? It’s not for radically new functions—the core components remain the same: transistors and interconnections. According to Moore’s law, transistors are getting smaller, with more interconnection layers added, making the manufacturing process longer and more costly. In reality, we’re paying for the inability of engineers to efficiently solve engineering challenges. This project leverages System Functional Modeling (SFM) to analyze the IC interconnection layer and Process Functional Modeling (PFM) to evaluate its manufacturing process. These analyses aim to deepen our understanding of both the device and the production process, generating innovative solutions for cost reduction and improved efficiency.
The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage