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Updated 08/18/2022
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Wafer cleaning issues at the wet process

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Updated 07/29/2022
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Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage

Anatoly Agulyansky