Model of the failure:
The chemistry evaporates too fast, therefore particles remain on the
Short term solution:
Reduce the evaporation rate of the chemistry (water at rinsing)
Use a shower (multiple nozzles system) instead of a single movable nozzle. The flow should be adjustable above different areas of the wafer.
Adjust recipe for no "empty" areas on the wafer during the process
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage