Updated 12/5/2022

Wafer cleaning issues at the wet process

Current situation

Defects were found on the surface of the wafer after washing with the chemistry and rinsing with water.


  • The wafer contaminated with defects cannot be sold to the customer. The defective wafers will be scrapped.
  • The process strongly depends on chemicals. Small change even within spec limits causes contamination of the wafers and a drop in the yield.
  • The process and products are at high risk of failure due to even insignificant changes.

Problem statement

Defects remain on the wafer surface after the wet cleaning process step.

Success criteria

Stable yield after using the chemistry from different vendors with no cost increase.

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Updated 09/21/2022

Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage

Anatoly Agulyansky