Updated 06/14/2024

Wafer cleaning issues at the wet process

Current situation

Defects were found on the surface of the wafer after washing with the chemistry and rinsing with water.


  • The wafer contaminated with defects cannot be sold to the customer. The defective wafers will be scrapped.
  • The process strongly depends on chemicals. Small change, even within spec limits, causes contamination of the wafers and a drop in the yield.
  • The process and products are at high risk of failure due to even insignificant changes.

Ideal final result

Stable yield after using the chemistry from different vendors with no cost increase.


Certain type of chemistry creates and leave defects on the silicon wafer during wet cleaning

Problem statement

The current wet process for wafer cleaning results in defects on the wafer surface, leading to scrapped wafers and decreased yield.
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