Defects were found on the surface of the wafer after washing with the chemistry and rinsing with water.
Defects remain in the wafer surface after the wet cleaning process step
Stable yield after using the chemistry from different vendors with no cost increase.
Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage