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To address the requirement for smaller and more powerful processors, innovative 3D packaging is developed, which involves stacking many layers vertically. This enhances performance but produces mechanical difficulties such as wafer bowing as a result of internal tension caused by thermal expansion mismatch. this problem has approached from a materials engineering perspective, investigating how material selection, layer thickness, and deposition conditions may minimize stress and prevent deformation.

The project was dedicated to production yield improvement in microchip manufacturing. The bumps are created on the top of a wafer and used for the final test of all dies. Only good dies are taken for the packaging. All dies that fail the test will be scrapped. The process yield depends on the amount of "good" and "bad" dies. It was revealed that in some cases, the time between the end of the process and the final test impacts the yield. The longer the dwelling, the more dies fail the final test. If the dwelling exceeds hundreds of hours, the amount of failed dies becomes dramatically high, which results in the scrapping of the whole wafer. The problem was analyzed and solved.

An example of how to make task prioritization with Urgency - Important Matrix (UMI) using the PRIZ Innovation Platform

The vacuum cleaner problem is an excellent example showing how to manage and resolve excursion - unexpected deviation from normal operation. Read, learn and use the platform for resolving of your excursions.

The vacuum furnace is used for sintering parts made of metal powder. To keep the shape of the parts, a binder is used. The main problem is that the vacuum furnace becomes dirty and needs a very long cleaning. Regular washing was not successful. We investigated the process and found that washing should be dedicated to the conversion of the material into a form that results in the formation of gases having low temperature of the condensation