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30 results in all PRIZ Hub projects

Updated 07/25/2024
11
Project Poster | Diffusion furnace - Process Functional Modeling (PFM)

The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

Updated 07/24/2024
1
Project Poster | מניעת עיבוי על העדשות - רוני עוז ותומר קליין

?כיצד נוכל למנוע הצטברות של אדים על גבי העדשה בתנאי סביבה שונים כדי לשפר את הראייה והבטיחות

Updated 07/23/2024
2
Project Poster | Recycling waste of solar panels.

students: 
Alaa & saed

Excited to share our latest project at Ben-Gurion University of the Negev! 🚀 We tackled the pressing issue of solar panel waste and explored innovative recycling solutions to make solar energy truly sustainable. Key insights: Solar panel waste could hit 78 million metric tons by 2050. Only 10% of panels are currently recycled in the EU. Our project highlights the need for efficient recycling technologies, better regulations, and economic incentives to drive sustainable practices. Let’s work together for a greener future! 🌱

Updated 07/21/2024
3
Project Poster | Converting Metal to Metal-Halide Perovskites
By : Layla Khateeb and Aviv Dahari.

This project aims to develop an efficient and reproducible method for synthesizing perovskites from metals with halides. The focus will be on addressing material synthesis challenges, ensuring scalability from laboratory to industrial production, optimizing the physical and chemical properties, and minimizing the environmental impact.

Updated 07/17/2024
9
Project Poster | Wafer cleaning issues in the wet process

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.