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Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.

The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

An example of how to make task prioritization with Urgency - Important Matrix (UMI) using the PRIZ Innovation Platform

The vacuum cleaner problem is an excellent example showing how to manage and resolve excursion - unexpected deviation from normal operation. Read, learn and use the platform for resolving of your excursions.

The vacuum furnace is used for sintering parts made of metal powder. To keep the shape of the parts, a binder is used. The main problem is that the vacuum furnace becomes dirty and needs a very long cleaning. Regular washing was not successful. We investigated the process and found that washing should be dedicated to the conversion of the material into a form that results in the formation of gases having low temperature of the condensation